Materials for high-density electronic packaging and interconnection.

By:

National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging

Material type: Text

TextPublication details: Washington, D.C. : National Academy Press, 1990.Description: 1 online resource (xiv, 139 pages) : illustrationsContent type:

text

Media type:

computer

Carrier type:

online resource

ISBN:

0585143951
9780585143958
030904233X
9780309042338

Subject(s):

Genre/Form:

Electronic books.

Additional physical formats: Print version:: Materials for high-density electronic packaging and interconnection.DDC classification:

621.381/046 20

LOC classification:

TK7870 .N35 1990eb

Online resources:

EBSCOhost

Holdings ( 1 )
Title notes ( 5 )

Holdings
Item type	Current library	Collection	Call number	Status	Date due	Barcode	Item holds
eBook	e-Library	EBSCO Technology		Available

Total holds: 0

Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

Available from Defense Technical Information Center, Cameron Station.

"NMAB-449."

Includes bibliographical references.

Print version record.